【优质展商】光道激光——专注激光设备切割、陶瓷打孔等精密加工设备

IACE CHINA 2026

由新之联伊丽斯（上海）展览有限公司主办的“第18届中国国际先进陶瓷展览会”将于2026年3月24-26日在国家会展中心（上海）隆重举办。展览内容涵盖先进陶瓷领域原材料、机械设备、部件产品及服务等整条工艺链。展会规模达55,000平方米，云集1,000+家中外企业参展，参展品牌2,000个，国内外观众预计将达到80,000人次。

优质展商揭幕

深圳市光道激光技术有限公司

SHENZHEN GUANGDAO LASER TECHNOLOGY CO.,LTD.

国家会展中心（上海）

1.1馆 L060

主营产品

MAIN PRODUCTS

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IACE CHINA 2026

01

光纤精密钻孔机

Precision fiber optic drilling machine

产品简介

应用行业：冶金，LED，半导体，陶瓷电路板，玻璃 五金等，激光切割钻孔材料：主要用于氧化铝陶瓷、氮化铝陶瓷、氧化锆陶瓷、蓝宝石等硬脆非金属材料的精密切割/钻孔/划线；也适用于部分薄金属片的精密切割；激光钻孔能力：0.03mm~0.2mm

作为国内最早进入电子陶瓷激光加工领域的厂商之一，多年的技术积淀和持续的研发投入，得到市场的充分认可。市场占有率这一块一直属于国内第一梯队。设备以高效率，高稳定性成就了设备总体的优秀性能，造就了设备的高性价比，赢得了广大客户的青睐。

Application industries: Metallurgy,LED, semiconductor, ceramic circuit boards, glass, hardware, etc. Laser cutting and drilling materials: Mainly used for precise cutting/drilling/lining of hard and brittle non-metallic materials such as aluminum oxide ceramics, aluminum nitride ceramics, zirconia ceramics, and sapphire; also suitable for precise cutting of some thin metal sheets; Laser drilling capacity: 0.03mm - 0.2mm

As one of the earliest domestic manufacturers to enter the field of electronic ceramic laser processing, with years of technical accumulation and continuous research and development investment, it has been fully recognized by the market. Its market share has always been in the first echelon of domestic products. The equipment's high efficiency and high stability have achieved excellent overall performance of the equipment, resulting in high cost-effectiveness of the equipment and winning the favor of a large number of customers.

IACE CHINA 2026

02

二氧化碳精密切割机

CO2 precision cutting machine

产品简介

应用行业：冶金，LED，半导体，陶瓷电路板，玻璃 五金等，激光切割钻孔材料：陶瓷（氧化铝、氮化铝、蓝宝石） 薄金属 玻璃.主要用于氧化铝陶瓷、氮化铝陶瓷、氧化锆陶瓷、蓝宝石等硬脆非金属材料的精密切割/划线；激光切割能力：≤2mm(可定制)。作为国内最早进入电子陶瓷激光加工领域的厂商之一，多年的技术积淀和持续的研发投入，得到市场的充分认可。市场占有率这一块一直属于国内第一梯队。设备以高效率，高稳定性成就了设备总体的优秀性能，造就了设备的高性价比，赢得了广大客户的青睐。

Application industries: Metallurgy, LED, Semiconductor, Ceramic Circuit Boards, Glass, Hardware, etc. Laser cutting and drilling materials: Ceramics (alumina, aluminum nitride, sapphire), thin metals, glass. Mainly used for precise cutting/lining of hard and brittle non-metal materials such as alumina ceramics, aluminum nitride ceramics, zirconia ceramics, and sapphire; Laser cutting capacity: ≤2mm (customizable). As one of the earliest domestic manufacturers entering the field of electronic ceramic laser processing, years of technical accumulation and continuous research and development investment have been fully recognized by the market. Its market share has always been in the first echelon of domestic products. The equipment's high efficiency and high stability have achieved excellent overall performance, resulting in high cost-effectiveness of the equipment and winning the favor of a wide range of customers.

IACE CHINA 2026

03

紫外皮秒精密激光切割机

UV picosecond precision laser cutting machine

产品简介

应用行业：半导体电子元器件，5G通信，汽车电子与传感器，医疗器械与生物材料等领域。主要用于LTCC生坯材料的通孔、盲孔以及开腔体等各种材料的刻蚀切割的精蜜加工。技术特点：自研高精度紫外皮秒激光加工系统，实现对LTCC生瓷带切割，钻微孔（直径0.03-0.3mm）,开窗（在特定层上开腔，用于芯片和传感器的嵌入），异型结构等复杂图形加工。通过多年技术积淀和持续研发投入，设备向高效率，高稳定性，智能化发展。主要特点：高效率：进口高速振镜与软件核心算法高高度匹配，提升生产效率，适合大批量制造。更高精度，达到亚微米级切割能力，满足5G通信器件要求。智能化：集成AI算法，自动优化切割路径与参数。

Application industries: Semiconductor electronic components, 5G communication, automotive electronics and sensors, medical devices and biomaterials, etc. It is mainly used for the precision processing of various materials such as through holes, blind holes, and cavities in LTCC pre-form materials, including etching and cutting. Technical features: Self-developed high-precision ultraviolet picosecond laser processing system, which realizes the cutting of LTCC pre-ceramic tapes, drilling of micro holes (diameter 0.03 - 0.3mm), windowing (opening cavities on specific layers for embedding chips and sensors), and processing of complex patterns such as irregular structures. Through years of technological accumulation and continuous R&D investment, the equipment has developed towards higher efficiency, higher stability, and intelligence. Main features: High efficiency: High matching between imported high-speed galvanometers and software core algorithms to improve production efficiency and suitable for mass production. Higher precision, achieving sub-micron cutting capability, meeting the requirements of 5G communication devices. Intelligence: Integrated AI algorithms, automatically optimizing cutting paths and parameters.

IACE CHINA 2026

04

红外皮秒精密激光切割机

Infrared picosecond precision laser cutting machine

产品简介

应用行业：半导体电子元器件，陶瓷DPC/DBC，5G通信，汽车电子与传感器，显示屏盖板等领域。技术特点：自研高精度红外皮秒激光加工系统，可加工氧化铝、氧化锆、氮化铝、碳化硅、压电陶瓷等多种先进陶瓷，不受材料导电性或硬度限制。主要特点：极小的热影响区：皮秒激光的超短脉冲特性使得能量在材料上几乎不产生熔融、裂纹或热应力，显著减少热损伤，避免陶瓷材料因热膨胀产生微裂纹或崩边。高精度：可实现微米甚至亚微米级的加工精度，适用于微孔、微槽、复杂图案等精细结构的加工，边缘清晰、轮廓准确。高效率：由于加工质量高、表面粗糙度低、无毛刺或裂纹，通常可省去或简化传统的研磨、抛光等后处理步骤，提高生产效率。

Application fields: Semiconductor electronic components, ceramic DPC/DBC, 5G communication, automotive electronics and sensors, display cover plates, etc. Technical features: Self-developed high-precision infrared picosecond laser processing system, capable of processing various advanced ceramics such as aluminum oxide, zirconium oxide, aluminum nitride, silicon carbide, piezoelectric ceramics, etc., without being limited by the conductivity or hardness of the materials. Main features: Extremely small heat affected zone: The ultra-short pulse characteristics of picosecond laser ensure that the energy hardly causes melting, cracks or thermal stress on the material, significantly reducing thermal damage and avoiding micro cracks or edge breakage of ceramic materials due to thermal expansion. High precision: Capable of achieving micrometer or even sub-micrometer level processing accuracy, suitable for processing fine structures such as micro holes, micro slots, and complex patterns, with clear edges and accurate contours. High efficiency: Due to high processing quality, low surface roughness, and no burrs or cracks, it usually eliminates or simplifies traditional grinding, polishing and other post-processing steps, improving production efficiency.

IACE CHINA 2026

05

高速光纤精密钻孔机

High-speed optical fiber precision drilling machine

产品简介

应用行业：冶金，LED，半导体，陶瓷电路板，玻璃等，激光切割钻孔材料：主要用于氧化铝陶瓷、氮化铝陶瓷、氧化锆陶瓷、蓝宝石等硬脆非金属材料的精密切割/钻孔/划线；高速钻孔机技术特点：自研高速激光加工控制系统，进口直线电机，大推力，高响应，再加上软件核心算法的优化提升，针对陶瓷（氧化铝，氮化铝等材料）在原有基础上钻孔效率提高30%，为客户提供高效率，高性价比解决方案。

Application industries: Metallurgy, LED, Semiconductor, Ceramic Circuit Boards, Glass, etc. Laser cutting and drilling materials: Mainly used for precise cutting/drilling/lining of hard and brittle non-metallic materials such as aluminum oxide ceramics, aluminum nitride ceramics, zirconia ceramics, and sapphire; Key features of high-speed drilling machine technology: Self-developed high-speed laser processing control system, imported linear motors, large thrust, high response, and further optimization and improvement of the core software algorithm. Compared to the original state, the drilling efficiency of ceramics (aluminum oxide, aluminum nitride, etc.) has been increased by 30%, providing customers with high-efficiency and cost-effective solutions.

COMPANY PROFILE

关于光道激光

深圳市光道激光技术有限公司秉承“专业商务，专业技术，专注品质” 的理念，致力于激光技术为主要依托，为精密电子、半导体及LED 制造业和加工业提供高科技，高品质的技术支持与服务．凭借着优良的产品品质，丰富的行业经验, 完善的技术服务, 光道激光在电子业界得到了众多电子产品生产厂家的认和信任，目前公司激光切割代工项目是同类产品及服务类别最全面、最专业的精密激光技术应用企业之一。

“合作共赢，共同成长” 一直是公司不懈追求的目标，公司自成立以来，公司一直致力于为中国电子产业、半导体、ＬＥＤ产业及PCB 产业引入先进观念与尖端技术，技术精益求精，品质永无止境，快速出货响应更是我们发展的方向。为报答业界对光道激光的认可与信任，光道激光将以更具前瞻、更高品质的产品服务业界．

我们期望成为国内电子、半导体、ＬＥＤ产业和PCB 产业的“激光加工专家”，秉持“专业商务，专业技术，专注品质”的理念，不断引进尖端科技，为中国电子、半导体、ＬＥＤ支架、PCB 业界提供更加优质产品与服务，以推动中国电子产业的发展，与中国电子业同发展共繁荣！

Shenzhen Guangdao Laser Technology Co., Ltd. adheres to the concept of "professional business, professional technology, and dedication to quality", and is committed to providing high-tech and high-quality technical support and services for precision electronics, semiconductor and LED manufacturing and processing industries based on laser technology. With excellent product quality, rich industry experience, and comprehensive technical services, Guangdao Laser has gained recognition and trust from many electronic product manufacturers in the electronics industry. Currently, the company's laser cutting outsourcing project is one of the most comprehensive and professional precision laser technology application enterprises in the electronic industry.

"Win-win cooperation and common growth" has always been the company's unremitting pursuit. Since its establishment, the company has been committed to introducing advanced concepts and cutting-edge technologies to the Chinese electronics industry, semiconductor industry, LED industry and PCB industry. The technology is constantly refined, the quality is never-ending, and rapid delivery response is our development direction. To express gratitude to the industry for recognizing and trusting Guangdao Laser, Guangdao Laser will provide the industry with more forward-looking and higher-quality products and services.

We hope to become the "laser processing experts" in the domestic electronics, semiconductor, LED industry and PCB industry. Adhering to the concept of "professional business, professional technology, and dedication to quality", we will continuously introduce cutting-edge technology to provide more high-quality products and services for the Chinese electronics, semiconductor, LED brackets, and PCB industries, to promote the development of the Chinese electronics industry and achieve common development and prosperity together!

请对贵公司情况进行简要介绍

深圳市光道激光技术有限公司成立于2013年，是一家集研发、生产、销售及代工陶瓷精密激光加工设备、新能源激光焊接设备、半导体精细切割设备、非标自动化订制设备于一体的国家高新技术企业。

作为国内最早介入陶瓷激光切割加工的企业之一，公司拥有激光行业从业经验十五年以上的专业研发技术人员多名，秉承“专精技术，专注品质，专业服务”的理念，基于多年激光加工经验，为精密电子、半导体、LED制造业、线路板制造业、新能源动力电池焊接等提供高端激光精密设备和应用解决方案，并为客户提供技术研发服务和定制化产品。

未来，光道激光将坚持自主创新及持续优化客户的工艺需求。核心技术团队将凭借十多年激光关键技术及激光加工成套设备研发制造的雄厚底蕴和丰富经验，在陶瓷、蓝宝石等硬脆材料加工以及新能源焊接领域等多个高端精密加工领域继续引领先河。

本次带来哪些新技术、新产品？

1. LTCC激光精密切割机，自研高精度紫外皮秒激光加工系统，实现对LTCC生瓷带切割，钻微孔（直径0.03-0.3mm）,开窗（在特定层上开腔，用于芯片和传感器的嵌入），异型结构等复杂图形加工。通过多年技术积淀和持续研发投入，设备向高效率，高稳定性，智能化发展。主要特点：高效率：进口高速振镜与软件核心算法高高度匹配，提升生产效率，适合大批量制造。更高精度，达到亚微米级切割能力，满足5G通信器件要求。智能化：集成AI算法，自动优化切割路径与参数。

2. 红外皮秒激光精密切割机，自研高精度红外皮秒激光加工系统，可加工氧化铝（AlO）、氧化锆（ZrO）、氮化铝（AlN）、碳化硅（SiC）、压电陶瓷（如PZT）等多种先进陶瓷，不受材料导电性或硬度限制。主要特点：极小的热影响区：皮秒激光的超短脉冲特性使得能量在材料上几乎不产生熔融、裂纹或热应力，显著减少热损伤，避免陶瓷材料因热膨胀产生微裂纹或崩边。高精度：可实现微米甚至亚微米级的加工精度，适用于微孔、微槽、复杂图案等精细结构的加工，边缘清晰、轮廓准确。高效率：由于加工质量高、表面粗糙度低、无毛刺或裂纹，通常可省去或简化传统的研磨、抛光等后处理步骤，提高生产效率。

3. 高速光纤激光精密钻孔机，自研高速激光加工控制系统，进口直线电机，大推力，高响应，再加上软件核心算法的优化提升，针对陶瓷（氧化铝，氮化铝等材料）在原有基础上钻孔效率提高30%，为客户提供高效率，高性价比解决方案。

贵公司近三年的发展情况如何？

贵司产品在业内的使用情况和口碑如何？

近三年公司稳步发展，专注激光设备切割、陶瓷打孔等精密加工设备研发与生产，技术不断升级，产能和市场规模持续扩大。公司管理规范、经营稳定，产品质量和服务能力不断提升，整体发展态势良好。

公司激光切割、陶瓷打孔设备精度高、稳定性好、性价比高，广泛应用于电子、陶瓷、半导体等行业，深受客户认可。产品在业内口碑良好、使用稳定、故障率低，客户满意度高，市场反馈积极。

当前国内外的行业经济形势如何？

贵司在2026-2027年有些什么举措？

全球精密制造稳步复苏，激光精密加工、陶瓷打孔需求持续增长，国内受益于新能源、半导体、电子陶瓷产业升级，高端装备国产替代加快，行业整体稳中向好。

1. 聚焦激光切割、陶瓷打孔技术升级，提升精度与稳定性，优化产品性能。

2. 拓展优质客户，深耕电子、陶瓷、半导体等领域，扩大市场份额。

3. 强化品质管控与售后服务，降本增效，提升核心竞争力与品牌影响力。

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